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Showing posts with label Memory. Show all posts
Showing posts with label Memory. Show all posts

AMD Ryzen ThreadRipper 3000 and TRX40 chipsets available from November 19 | rumor

After the Intel Core X 10a gen processors presented earlier this month | Intel Core-X 10a gen and Xeon W-2200: up to 18 cores and half prices | many expect the AMD response with Ryzen ThreadRipper 3rd gen at 7nm (3000 series), expected on the market for November, as confirmed by the company in its latest release | AMD Ryzen ThreadRipper 3000 processors, debut scheduled for November .

According to the recent videocardz report , based on a confidential document apparently from internal AMD sources, the new ThreadRipper CPUs will be unveiled on November 5th together with the next-generation TRX40 chipset . More specifically, the document suggests that on November 5th there will be a so-called "paper launch", an occasion in which AMD will reveal to the public the new line of processors led by the Ryzen ThreadRipper 3990X , flanked by the ThreadRipper 3970X and ThreadRipper 3960X models and the TRX40 chipset.

Two weeks later, on November 19th, AMD will remove the embargo on Ryzen ThreadRipper 3970X and ThreadRipper 3960X processors (with related reviews) and the first motherboards based on the TRX40 platform. As for the top model, Ryzen ThreadRipper 3990X , the specifications will be released only in January 2020 , close to the actual availability on the market.

The aforementioned document does not refer to the technical characteristics of the new chips (number of cores, frequencies, TDP etc.), however, the recent sighting on the Ashes of the Singularity database of the Ryzen ThreadRipper 3960X with 24 cores (link in VIA ) suggests that AMD could present at least 4 models. Here's how the new Ryzen ThreadRipper 3000 lineup could be made up:

Ryzen ThreadRipper 3960X: 24 cores / 48 threads

Ryzen ThreadRipper 3970X: 32core / 64 threads

Ryzen ThreadRipper 3980 (W) X: 48core / 96 threads (?)

Ryzen ThreadRiper 3990 (W): 64core / 128 threads

For the moment, AMD has not commented on the news, so we await further developments and above all direct confirmation from the manufacturer


MediaTek Helio G90, G90T Officially Announced to Help Make Gaming Phones Affordable

The mobile gaming industry has swelled exponentially over the past year, thanks to one battle royale title, witnessing a major shift in what users desire from their smartphones. This led Qualcomm to unveil their first-ever gamer-centric chipset earlier this year. Well, the American chipmaker has since also launched a souped-up variant of its Snapdragon 855 flagship chipset as well.

MediaTek has been rumored to be launching a new chipset to take on Qualcomm’s ever-growing dominance. And well, it’s doing just that with the launch of its first dedicated gamer-centric Helio G90 and G90T chipset. They’ll enable low-latency, stutter-free gameplay and better performance at lower price points.

MediaTek Helio G90 series includes octa-core chipsets, which utilize the Cortex-A76 and Cortex-A55 CPU architecture. These are paired with the Mali-G76 3EEMC4 GPU, with speeds of up to 800MHz. This is higher than even the 672MHz overclock speed of the Adreno 640 GPU in Snapdragon 855 Plus. You can include up to 10GB of LPDDR4x RAM, with peak frequency up to 2133MHz. MediaTek has also bundled a large L3 cache and is offering speeds up to 2.05GHz for smoother gameplay and app performance.

Boasting about the capabilities of the new Helio G90 chipset, TL Lee, General Manager of MediaTek’s Wireless Communication business unit in an official statement said, “With the Helio G90 series, you get a super-fast and responsive display, reduced lag for smoother gameplay – because every millisecond counts in the gaming world. Whether it’s Fortnite, PUBG or other top titles, this chip is a gaming powerhouse.”

One of the most striking features of the Helio G90 & G90T chipsets has to be MediaTek’s HyperEngine game technology. It’s a software feature which is said to ‘tune the entire smartphone for the greatest gaming experience possible.’ HyperEngine is a collection of software features that sees to the fact that the gameplay isn’t hampered in any possible way.

MediaTek Helio G90 will allow the smartphone to connect with two Wi-Fi bands (both the 2.4GHz/5GHz) for improved latency, won’t drop the data connection when you receive a call, and kick in WiFi+LTE concurrency when the network quality starts to degrade. This chipset also packs a rapid response engine to improve in-game action-to-display speeds using touch acceleration.

The HyperEngine also works to deliver optimum performance via CPU and GPU resource management, improving power consumption for longer gameplay times. Finally, it packs support for HDR10 standard with a 10-bit color depth for vivid photos on HDR-supported screens.

Moving past the hardware specs, the Helio G90 series also supports up to 64MP cameras because that’s the latest fad. Phone makers can use multi-camera configurations, with a triple-ISP design backing the hardware. This helps optimize power and performance while also offering night shot mode, AI facial unlock, and much more.

MediaTek hasn’t pointed out the difference in the Helio G90 and G90T chipset, but we’re assuming that it’s got to do with peak clock frequency. We should expect to see phones (possibly, first from Realme) powered by the Helio G90 in the next couple of months. Do tell us your opinion on this gamer-centric chipset in the comments below.

MediaTek Helio G: mobile gaming SoCs should arrive on July 30th

MediaTek's new mobile SoC family dedicated to gaming could be the protagonist of the event that the chipmaker will hold in a few days, on July 30th. The series should be called Helio G (G as Gaming, of course) and a first model has already been sighted. In fact, a teaser published a few days ago spoke of Helio G90 , without revealing any technical details. Also the new teaser, visible here on the side, has a clearly gaming matrix, which supports the theory that Helio G will be the protagonists of the event.

The niche of mobile hardware specialized in gaming is expanding: even if it was not without improved aspects ( updates in the first place ), the arrival of the first dedicated smartphones (including ASUS ROG Phone 1 and 2 , Xiaomi Black Shark 1 and 2 , Razer Phone 1 and 2 ) gave the market a shock that even the chipmakers seem to have noticed. The main advantages of some of the latest SoCs presented, such as Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 810, are found just on the GPU side. Appointment then in a few days to find out how the Helio G. family will be structured.


Apple announces acquisition of Intel's cellular modem business for a billion dollars

Earlier this week, it was reported that Apple would be acquiring Intel's smartphone modem business. Today, Apple announced the billion-dollar deal. The original report was pretty spot-on, with the deal being worth $1B and it including patents, employees, and equipment. The deal is expected to close in the fourth quarter of this year.

“This agreement enables us to focus on developing technology for the 5G network while retaining critical intellectual property and modem technology that our team has created,” said Intel CEO Bob Swan. “We have long respected Apple and we’re confident they provide the right environment for this talented team and these important assets moving forward. We’re looking forward to putting our full effort into 5G where it most closely aligns with the needs of our global customer base, including network operators, telecommunications equipment manufacturers and cloud service providers.”

With this deal, 2,200 Intel employees will join Apple, and the company says that it will now hold more than 17,000 wireless technology patents, now that it has absorbed Intel's patents.

Interestingly, Intel will still be able to make cellular modems, just not for smartphones. That means that if you buy a PC that connects to a 4G LTE network, it could have an Intel modem.

But Intel's entire cellular business has been struggling. Back in February, Intel announced that its 5G modem would be delayed until 2020. After Apple and Qualcomm settled their legal disputes, Intel said it was canceling its 5G plans altogether, just hours later. 5G PCs are coming next year, and Intel clearly won't be a part of that, so while the firm can continue to make modems for PCs, it clearly won't be a part of that next generation.

While today's deal should give Apple what it needs to get involved with 5G without relying on Qualcomm, don't expect to see it this year. After all, new iPhones will be announced in about a month and a half, and this deal won't be finalized until the fourth quarter of this year. 2020 or 2021 seems more likely for a 5G iPhone, and most customers won't have access to the technology until then anyway.


AMD responds to Nvidia with lower prices for its new Radeon GPUs

Last month at E3, AMD announced new Radeon GPUs which threatened to put a dent in some on Nvidia's RTX offerings thanks to their comparatively lower prices. In response to the impending release of AMD's cards, Nvidia decided to fight back with the new RTX Super cards earlier this week, which offer more performance for the same price, save for the RTX 2060 Super.

Now, in a nearly perfect demonstration of why competition is good, AMD has responded to the green team's new offerings by lowering the price of the new Radeon RX 5700 series of GPUs before they're even officially released. In a tweet posted earlier today, the red team announced that the Radeon RX 5700, 5700 XT, and 5700 XT 50th Anniversary Edition will all start at lower price points than originally expected.

As such, the Radeon RX 5700 will now start at $349, $30 below the original price. The RX 5700 XT will now cost $399 instead of $449, and the RX 5700 XT 50th Anniversary Edition will cost $449 instead of $499. That means that each of the cards now matches the prices of Nvidia's RTX 2060, 2060 Super, and 2070 Super, respectively. Here's a rundown of the specs in AMD's cards:

AMD has been gaining some popularity in both the CPU and GPU markets, thanks in no small part to the fact that its offerings usually undercut the price of Nvidia and Intel's competing products. Nvidia's response may have come as something of a surprise, but AMD isn't giving up, and ultimately, that's better for gamers, who now have more choices at more compelling price points.

NVIDIA RTX SUPER line has specs, announcement date and leaked prices

NVIDIA is always bringing new features to the global graphics marketplace with the aim of providing its loyal customers with the best experiences of use in different activities. Recently information related to the price, specifications and date of product launches of the line ' RTX SUPER ' leaked on the internet, making clear the effort of the company to further boost their equipment in this family.

This information was shared with the public through VideoCardz , which left a detailed graphical comparison of the new GPUs with the versions released a few months ago. According to the shared data, the 'SUPER' models gained potentiation ranging from 15% to 16% when compared to normal RTX.

The figures show a real effort by NVIDIA to exceed the performance delivered by the Radeon RX 5000 line from AMD, which owns the second largest chip in the video card market and is the main competitor of the US technology giant.

Still according to the leak, the boards that will receive the nomenclature 'SUPER' are the RTX 2060, 2070 and 2080, managing to cover the main markets of the company's operations. The most "basic" model is under the speculation of suffering a price increase compared to its normal model due to the implementation of more memory, now counting with 8 GB.

Already the 2070 SUPER can cost $ 100 dollars less than the common, applying a surprising discount to those expected something more expensive. However, the top model of the three to be announced is likely to receive a reconfiguration to increase the number of cores and memory, something that should be directly reflected in the price.

In the table below it is possible to have a notion of the values ​​that can be applied by NVIDIA in its new GPUs, as well as the release date and availability to the market.


Huawei launches Kirin 810 chip with superior performance to Snapdragon 730 in benchmarks

After announcing the Honor Line 20 in Europe and China , Huawei also announced its newest intermediate processor, the Kirin 810 .

The chipset is intended for medium-cost smartphones with interesting features that include, for example, 7-nanometer lithography and superior performance to the Snapdragon 730 in benchmarks.

The hardware features eight cores (two ARM Cortex-A76 at 2.27 GHz + six ARM Cortex A-55 cores at 1.88 GHz) and MPEG Arm Mali-G52 GPU, with a performance 162% higher than the previous generation.

In addition, it provides support for Kirin Gaming technology, which improves the quality of the games and enhances the contrast and sharpness of the images.

In benchmarks, the Kirin 810 was able to deliver interesting results thanks to its NPU, based on Huawei's Da Vinci architecture .

According to tests performed by the Chinese manufacturer he was able to deliver 11% more performance in the Geekbench single-core test when compared to Qualcomm's SD730.

In GFXBench, in the Manhattan test in 1080p the intermediate processor showed a frame rate 44% higher than the competitor, with 15% more performance in the T-Rex 1080p test.

You can clearly notice that Huawei's focus on this hardware was games; artificial intelligence technologies optimize GPU performance by delivering graphics and high-definition effects.

The first smartphone to hit the market with the new chipset is the newly announced Huawei Nova 5 but soon it will also be implemented in Honor line models.


iPhone of 2020 can count on 5nm chip for efficiency never seen

Although the 2019 iPhones have not yet been officially presented to the world, something that is expected in September, new forecasts for Apple's future devices are coming to light next year thanks to the plans unveiled by Taiwanese TSMC chip maker ..

The Apple supplier has confirmed that it plans to start the production volume of chips with 5-nanometer lithography during the first quarter of 2020, offering transistor numbers 1.8 times higher than that found in 7nm chips, in addition to counting up to 15 % increase for the transmission speed of information on the chip.

According to TechWeb , TSMC still wants to go beyond the next few years aiming to build nanochips with only 3-nanometer lithography for the year 2022.

While TSMC and Apple work hand in hand to bring the 2020 iPhones to the market with a 5-nanometer chip, it looks like Qualcomm will work with Samsung to manufacture its Snapdragon 865 processors with Samsung's proprietary technology, 7 nanometers.

That means that, most likely, Qualcomm's next-gen chip will still offer the same lithographs used in its processors this year, and as a result may cause Apple to take the lead and make iPhones of 2020 will be the first smartphones to adopt the new 5-nanometer lithograph in their chipsets.

Of course, it is still too early to guarantee any information, but with TSMC already preparing to manufacture such chips on a large scale, it is very likely that some company has an interest in using them. Despite this, it is very likely that Apple will continue to adopt 7nm chip manufacturing with the 2019 iPhones.


Benchmarks: AMD Ryzen 9 3950X outperforms Intel Core i9-9980XE on Geekbench

Introduced during E3 2019, the new AMD processor seems to deliver the power promised by the manufacturer. At least that's what new benchmark tests indicate. Ryzen 9 3950X outperformed the Intel Core i9-9980XE competitor on Geekbench.

The AMD chip achieved 5868 points with only one core and 6,1072 points in the multi-core experiment. Already, Intel's rival scores around 5300 points in the single-core and 42,000 cores. Check below:

It is important to note that the model Ryzen 9 3950X achieved the same feat equipped with two cores less than the Core i9-9980XE - 16 colors for the first, against 18 of the second. The price is also lower: $ 899 and $ 2,000, respectively.

It is worth remembering that the AMD processor has Zen 2 main architecture and manufacturing process in 7 nanometer lithography. In addition, it has 32 threads, base clock of 3.5 GHz and boost in 4.7 GHz. To complete, the total cache is of 72 MB and the TDP, of 105 W.

Due to its welded design, the Ryzen 9 3950X still provides better thermal conditions. The model is a pioneer in the presence of 16 cores for the desktop segment .

What do you think of the Geekbench test between the AMD processor and Intel's rival model? Tell us your opinion in the space provided for comments.


Record: Seagate ships the world's first 16TB mechanical hard drive with Nine Discs

The mechanical hard disk market continues to shrink significantly, and the new technology advancement of Seagate and Western Digital's two giants is also extremely difficult. Three months ago, Seagate promised to mass-produce HAMR (Hot-Assisted Magnetic Recording) hard drives in the first half of this year , starting at 16TB.

According to Seagate's latest statement, as the world's first 16TB mechanical hard drive, the new Exos X16 has been shipped at the end of March, but not the HAMR, but the traditional PMR (Vertical Magnetic Recording), supplemented by TDMR (two Dimensional magnetic record).

This standard 3.5-inch hard drive not only uses the encapsulation technology, but also internally plugged nine discs for the first time. The previous limit was eight discs.

Don't just look at adding a disc, the difficulty is actually quite large, even before no one thinks it can be achieved. After all, this requires a thinner disc and support structure, and the entire hard drive interior is redesigned.

But this also reflects the fact that the traditional PMR technology has reached the limit: the eight-disc 14TB single-disc capacity is 1.75TB, and the nine-disc 16TB single-disc capacity is only 1.78TB, almost unchanged, or even no change at all. Just added some license capacity.

Seagate said that the Exos X16 16TB hard drive is currently being certified by a large number of cloud customers and corporate customers, and will be mass-produced later this year, and will become the highest-income single model at this time next year.

In addition, Seagate is still preparing 18TB hard drive, but it is still not HAMR, but SMR (stacked magnetic recording), the specification is still 3.5 inches.

So, what happened to Seagate’s promotion of HAMR for many years? According to the latest roadmap, Seagate will not be able to mass-produce HARM hard drives until next year, with a capacity of 20TB or higher, but there is no explanation why it is delayed.

It seems that the situation of HARM is not very good, either the new head, the new medium, the new disc still can't reach the expected reliable level, or the yield is not going up, the cost can't come.

In addition, Seagate is actively preparing for MAT (Multi-Reader and Arm) technology . The first generation of products has dual read/write arms and eight-disc, starting at 14TB. It was said to be launched later this year, and it can exceed 40TB in 2023, but Seagate did not give any progress updates.

credit: mydrivers